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Handbook of wafer bonding [electronic resource] / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo.

Contributor(s): Material type: TextPublication details: Weinheim, Germany : Wiley-VCH, 2012.Description: xxxi, 395 p. : col. illSubject(s): Genre/Form: LOC classification:
  • TK7871.85 .H36 2012eb
Online resources:
Contents:
pt. 1. Technologies -- pt. 2. Applications.
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Includes bibliographical references and index.

pt. 1. Technologies -- pt. 2. Applications.

Electronic reproduction. Palo Alto, Calif. : ebrary, 2011. Available via World Wide Web. Access may be limited to ebrary affiliated libraries.

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